The solders with halogen free "NO CLEAN" flux ensure high durability and reliability of soldered connections. Designed for hand and automatic soldering using through hole and SMD technologies. The solder composition guarantees good wettability of solder point ensuring at the same time good capillary properties. The soldered connections have good mechanical and electrical properties. No side product are produced which can form a deposit on PCB. During soldering a small amount of vapours is liberated. Available solders with and without lead. Solder composition - 96,5Sn/3Ag/0,5Cu Melting point - 217°C Flux - F-SW26 Weight content of the flux - 2,2%

The solders with halogen free "NO CLEAN" flux ensure high durability and reliability of soldered connections. Designed for hand and automatic soldering using through hole and SMD technologies. The solder composition guarantees good wettability of solder point ensuring at the same time good capillary properties. The soldered connections have good mechanical and electrical properties. No side product are produced which can form a deposit on PCB. During soldering a small amount of vapours is liberated. Available solders with and without lead. Solder composition - 96,5Sn/3Ag/0,5Cu Melting point - 217°C Flux - F-SW26 Weight content of the flux - 2,2%

Ecological solder, lead free, made on tin and silver basis. - Sn96Ag4 alloy is manufactured in continuous casting process without contact with air, and then extracted, which eliminates creation of oxides - silver content : 3,5% to 4,0% - tin content : the rest - melting temperature : eutectic 221°C - application temperature : 300°C to 380°C - density : 7,30 g/cm 3 - free halide flux on base of organic activators modified colophony Non-corrosive flux suitable for electronics and electrical engineering applications. Soldering residues need no cleaning Other diameter solders and stick solders available for customer individual order

Ecological solder, lead free, made on tin and silver basis. - Sn96Ag4 alloy is manufactured in continuous casting process without contact with air, and then extracted, which eliminates creation of oxides - silver content : 3,5% to 4,0% - tin content : the rest - melting temperature : eutectic 221°C - application temperature : 300°C to 380°C - density : 7,30 g/cm 3 - free halide flux on base of organic activators modified colophony Non-corrosive flux suitable for electronics and electrical engineering applications. Soldering residues need no cleaning Other diameter solders and stick solders available for customer individual order

Ecological solder, lead free, made on tin and silver basis. - Sn96Ag4 alloy is manufactured in continuous casting process without contact with air, and then extracted, which eliminates creation of oxides - silver content : 3,5% to 4,0% - tin content : the rest - melting temperature : eutectic 221°C - application temperature : 300°C to 380°C - density : 7,30 g/cm 3 - free halide flux on base of organic activators modified colophony Non-corrosive flux suitable for electronics and electrical engineering applications. Soldering residues need no cleaning Other diameter solders and stick solders available for customer individual order

The solders with halogen free "NO CLEAN" flux ensure high durability and reliability of soldered connections. Designed for hand and automatic soldering using through hole and SMD technologies. The solder composition guarantees good wettability of solder point ensuring at the same time good capillary properties. The soldered connections have good mechanical and electrical properties. No side product are produced which can form a deposit on PCB. During soldering a small amount of vapours is liberated. Available solders with and without lead. Solder composition - 96,5Sn/3Ag/0,5Cu Melting point - 217°C Flux - F-SW26 Weight content of the flux - 2,2%